Part of Content:
The PCB Design Guidelines are intended to provide a foundation for conveying Design for Manufacturing information to all of those that may influence the design of the product. The guidelines are not meant to replace the concurrent engineering interaction that is essential for optimum design results and product life cycle costs. Design trade-off analyses performed in conjunction with the design guidelines must also consider the manufacturing strategies and business direction of producing all products. Table of Content:
Manufacturing strategy, assembly strategy, industry trends, long rage plan, test strategy, test plan/sequence. new product industrialization, manufacturability review elements, equipment capability overview stencil printing, SMT placment, Reflow, DIP insertion, Axial insertion, radial insertion, contact systems, component preparation/lead forming, wave solder, cleaning, board transfer system, in Circuit test, functional test, Burn-in and environmental, coating and potting, plastic molding, wire/cable/terminal processing. Workmanship standards, overview, PCB Design, Land pattern, general consideration, via sizes, standard SMT parts, Rules for new SMT packages, through hole parts, design rules, placement rules, board routing, panelization. Design for testing, 3.1 Design Documentation Set, 3.2 Assembly Drawings, 3.3 Bills of Material, 3.4 Purchased Part Drawings, 3.5 Schematic Drawings, 3.6 PCB Panel Fabrication Drawings, 3.7 PCB Data/Files, 3.8 Programmed Part Drawings/Files, 3.9 Test Plans and Test Specifications, 3.10 Packaging Specifications, 3.11 Special Workmanship Standards, 3.12 Engineering Change Orders.

source:http://dcchapters.ipc.org/ found via google pdf search
Tags : pcb design guidelines, workmanship standards, fabrication drawings, assembly drawings, plastic molding, schematic drawings, smt packages, printed circuit board, component preparation, product life cycle, panelization, panel fabrication, plan sequence, google, contact systems
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