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The authors have developed a fast thermal cycling test method of evaluating the reliability of power modules. The method shortens the time required for a life evaluation test of Al wire bond lift-off to one-quarter of the conventional power cycling test method. The authors have also developed a technology for Cu lead interconnection structures that can be applied for higher current densities of chips and improved productivity, replacing the current Al wiring method. Power modules, which are used for an increasingly wide range of industrial applications, are used not only for inverter control of household electric appliances but also for high power applications that include automobiles, electric railroads, and electric power. Today’s power modules require far greater reliability with respect to electric performance, insulation efficiency, thermal performance, and strength, and so it is expected that the specifications of such modules will improve. It has also become necessary to rapidly develop and commercialize products of low cost and high reliability. The authors have developed and confirmed the effectiveness of a fast thermal cycling test method for evaluating the life of Al wire bond lift-off more quickly than the conventional method. Mitsubishi Electric Corporation is developing a new wiring structure that will meet the future needs for high current densities of chips as well as improved productivity for similar module configurations as the current Al wire bonded devices. Mitsubishi modification.
Tags : household electric appliances, mitsubishi electric corporation, electric railroads, current densities, performance insulation, mitsubishi electric, module configurations, wire bond, life evaluation, electric performance, power modules, structure content, conventional power, conventional method, evaluation test
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